Research Field
Compound Semiconductor Packaging Fabrication & Simulation
- - Innovative Direct Transfer-Bonding process for full-color micro-LEDs
- - Process optimization & structural analysis via finite element simulation
Gallium Oxide
Device Fabrication
- - High-quality β-Ga2O3 thin film growth via eco-friendly MIST-CVD
- - Defect control & uniformity improvement using Al-doped buffer layers
AI-driven Photonic
Design Optimization
- - Asymmetric MQW structure design to mitigate sidewall effects
- - Efficiency maximization through AI & computational science